SILICON Wafer Backgrinding

Delivering particle free process water for less surface defects from ripout, dishing, and contaminants

The system can handle variable filtration needs (from filtration membranes) and uses rotating blades to generate vortices, which cleans the membrane during filtration. This results in a reliable and consistent output due to higher water recovery, less frequent cleanings, higher systems efficiency, and reduced downtime.


Infineon Technologies

Recycling Ultra Pure Water from Silicon Back Grinding Process

Project Overview


Goals

Remove TSS to recycle water

Reduce wastewater disposal cost

High recovery rate while maintaining high flux


There is high fouling potential due to the nature of the particle being small in size, inorganic, and abrasive.

Challenges


Results

  • Average Flux: 306 LMH

  • TSS Removal: 99.9%*

  • Recovery: 95%+**

*Below detectable limit of EPA 160.1
**Maximum recovery achieved due to hold up volume in unit, higher recovery can be achieved with larger initial batch size

  Feed (left), permeate (middle), concentrate (right)

Feed (left), permeate (middle), concentrate (right)

infineon graph.png

Back to Applications

Name *
Name
Checkbox