SILICON Wafer Backgrinding

Delivering particle free process water for less surface defects from ripout, dishing, and contaminants

The system can handle variable filtration needs (from filtration membranes) and uses rotating blades to generate vortices, which cleans the membrane during filtration. This results in a reliable and consistent output due to higher water recovery, less frequent cleanings, higher systems efficiency, and reduced downtime.


Infineon Technologies

Recycling Ultra Pure Water from Silicon Back Grinding Process

Project Overview


Goals

Remove TSS to recycle water

Reduce wastewater disposal cost

High recovery rate while maintaining high flux


Small particle size, high fouling potential

Inorganic abrasive material

Challenges


Results

Currently, average flux 306 LMH

  • TSS Removal: 99.9%*

  • Recovery: 95%+**

*Below detectable limit of EPA 160.1
**Maximum recovery achieved due to hold up volume in unit, higher recovery can be achieved with larger initial batch size

  Feed (left), permeate (middle), concentrate (right)

Feed (left), permeate (middle), concentrate (right)

infineon graph.png

Back to Applications

Member Login
Welcome, (First Name)!

Forgot? Show
Log In
Enter Member Area
My Profile Not a member? Sign up. Log Out