SILICON Wafer Backgrinding
Delivering particle free process water for less surface defects from ripout, dishing, and contaminants
The system can handle variable filtration needs (from filtration membranes) and uses rotating blades to generate vortices, which cleans the membrane during filtration. This results in a reliable and consistent output due to higher water recovery, less frequent cleanings, higher systems efficiency, and reduced downtime.
Recycling Ultra Pure Water from Silicon Back Grinding Process
Remove TSS to recycle water
Reduce wastewater disposal cost
High recovery rate while maintaining high flux
There is high fouling potential due to the nature of the particle being small in size, inorganic, and abrasive.
Average Flux: 306 LMH
TSS Removal: 99.9%*
*Below detectable limit of EPA 160.1
**Maximum recovery achieved due to hold up volume in unit, higher recovery can be achieved with larger initial batch size
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